【For Professional Engineers】Blank LTE USIM Test Card Technical Specifications
HKCARD ELECTRONICS CO., LIMITED
As HKCARD ELECTRONICS CO., LIMITED, a leading manufacturer of specialized SIM test cards for 【For Professional Engineers】Blank LTE USIM Test Card Technical Specifications for mobile device testing, R&D, and network optimization.
Product Positioning
This card is exclusively designed for communication system testing and development. Not suitable for consumer use. Requires SIM programming expertise for operation. 12
Physical Specifications
▸ Tri-cut design (Standard/Micro/Nano SIM), compatible with 2FF/3FF/4FF formats
▸ Industrial-grade PVC material, supports repeated programming
▸ Package: 5 blank cards + latest writing software (with SIM unlock features) 36
Key Technical Parameters
▸ Memory capacity: 32K/64K/128K/256K (selectable)
▸ Encryption algorithms: Full support for COMP_V1-V3 & CMCC_COMP_V0
▸ Programmable fields: IMSI, ICCID, SID, NID, PIN/PUK, AKEY, etc.
▸ Network compatibility: GSM/WCDMA/LTE FDD testing environments 27
Core Functions
- System validation: Simulates network authentication for major carriers (China Mobile/Unicom/Telecom)
- Protocol testing: LTE Attach/Detach, CSFB fallback mechanisms
- Security testing: USIM authentication algorithm stress tests
- Roaming simulation: Cross-network SID/NID parameter configuration 111
Warnings
⚠ Laboratory use only
⚠ Requires dedicated programming tools (e.g., ProXsim writer)
⚠ Illegal modification violates Telecommunications Regulations Article 57 46
Technical Advantages
Industrial-grade IC chip with 5000+ rewrite cycles. Operating temperature: -25°C to 85°C. Complies with ETSI TS 102 221 V17.0.0 standards.